USB-IF（USB Implementers Forum）所屬的USB 3.0推廣小組在CES 2013大會中宣布，2014年USB 3.0將提昇傳輸速度一倍，達到10 Gbps。 
USB 3.0推廣小組表示，新版的USB 3.0規格將在今年完成，其通訊協定與舊版相容，主要強化資料編碼的傳輸速度、提昇I/O電力效率，預計明年開始用戶就可以取得支援10 Gbps的USB 3.0產品，並在2015年普及化。USB-IF向媒體表示，目前取得USB 3.0認證的產品已經超過700種，比去年增加90%。 
USB 3.0也被稱為SuperSpeed USB（超高速USB），新版本將繼續使用目前USB 3.0的線材與接頭，並與5 Gbps USB Hub、USB 2.0設備相容。不過目前使用的控制晶片可能無法直接升級，因此使用者可能需要更換硬體與Hub才能取得10 Gbps速度。 
目前USB 3.0的頻寬為5 Gbps，其主要競爭技術Thunderbolt則為雙向10 Gbps，並在使用光纖線材時距離可以長達100公尺。Intel規劃在2020年之前讓Thunderbolt達到雙向100 Gbps，2014年底Intel可能會推出支援雙向20 Gbps的控制器。 
USB與Thunderbolt皆是由Intel所制定，不過兩者也都是因為蘋果的採用而開始發揚光大：蘋果在推出iMac時捨棄其他介面只保留USB，讓USB獲得推廣的助力，Thunderbolt則是由蘋果優先取得一年專用權。目前USB周邊主要用於較普及的產品線，而Thunderbolt則大都用在需要高效率傳輸速度的儲存及顯示產品。（編譯/ithome沈經）

http://www.usb.org/press/USB-IF_Press_Releases/SuperSpeed_10Gbps_USBIF_Final.pdf

SuperSpeed USB (USB 3.0) Performance to Double with New Capabilities
USB 3.0 Promoter Group to Increase Data Through-put Performance of USB 3.0 to 10 Gbps

LAS VEGAS – January 6, 2013 – The USB 3.0 Promoter Group today announced
development of a SuperSpeed USB (USB 3.0) enhancement that will add a much higher
data rate, delivering up to twice the data through-put performance of existing SuperSpeed
USB over enhanced, fully backward compatible USB connectors and cables. This supplement
to the USB 3.0 specification is anticipated to be completed by the middle of this year.

Key characteristics of the higher-rate SuperSpeed USB solution include:

• New 10 Gbps USB data rate
• Compatibility with existing cables and connectors
• Improved data encoding for more efficient data transfer leading to higher throughput
and improved I/O power efficiency
• Compatible with existing USB 3.0 software stacks and device class protocols
• Compatible with both existing 5 Gbps and new 10 Gbps USB 3.0 hubs and devices,
as well as USB 2.0 products

“With USB technology continuing to be the data and power delivery path of choice across
personal computing and consumer electronics, we are always looking ahead to how to best
improve user experience and connectivity performance,” said Brad Saunders, USB 3.0
Promoter Group Chairman. “Doubling SuperSpeed USB performance will be especially
beneficial for emerging USB docking and storage applications.”

“For our customers, 10Gbps USB represents an important evolution in this ubiquitous I/O
standard,” said Mark VandenBrink, Vice President and Chief Technology Officer, PC Global
Business Unit, HP. “By doubling the bandwidth while maintaining full backwards
compatibility with the broad ecosystem of USB peripherals and software, we will be able to
better meet the needs of our customers with this high-speed technology.”

“We recognize that more mainstream client computing applications are going to need higher
through-put to user-connected peripherals and devices,” said Alex Peleg, Vice President,
Intel Architecture Group. “Intel is fully committed to delivering 10Gbps USB performance to
these platforms while retaining compatibility with the existing USB ecosystem to help to
satisfy user demand for low-cost, higher-performance solutions.”

“Microsoft has been a strong supporter of the USB community where we have advocated
balancing innovation and compatibility. The planned updates to USB 3.0 are consistent with
our views," said Dennis Flanagan, General Manager, Windows Ecosystem Engagement.

"These updates will enable higher data rates and allow combining of disk, high-definition
audio/video and networking traffic on a single cable — all while maintaining compatibility
with billions of existing devices.”

“This enhancement builds on the tremendous success of USB and expands its capability by
doubling the data rate,” said Roland Sperlich, TI Consumer and Computing Interface
Product Line Manager. “While maintaining backward compatibility, the 10 Gbps data rate
allows users to do more with a universal standard that can be leveraged by many
industries.”

The 10 Gbps SuperSpeed USB update is targeted for industry review during the first quarter
of this year. Further information regarding the specification and plans for pre-release
industry reviews will be provided via the USB Implementers Forum (USB-IF) website at
http://www.usb.org/developers/USB-Futures.pdf.

About the USB 3.0 Promoter Group
The USB 3.0 Promoter Group, comprised of Hewlett-Packard Company, Intel Corporation,
Microsoft, Renesas Electronics, ST-Ericsson and Texas Instruments, developed the USB 3.0
Specification that was released in November 2008. In addition to maintaining and enhancing
this specification, the USB 3.0 Promoter Group develops specification addendums to extend
or adapt its specifications to support more platform types or use cases where adopting USB
3.0 technology will be beneficial in delivering a more ubiquitous, richer user experience.

About the USB-IF
The non-profit USB Implementers Forum, Inc. was formed to provide a support organization
and forum for the advancement and adoption of USB technology. The USB-IF facilitates the
development of high-quality compatible USB devices through its logo and compliance
program, and promotes the benefits of USB and the quality of products that have passed
compliance testing. Further information, including postings of the most recent product and
technology announcements, is available by visiting the USB-IF website at www.usb.org.

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超高速USB 3.0升級版標準 年中完成制訂

USB 3.0提倡小組周日時表示升級版的超高速USB 3.0標準傳輸速率將提升至10Gbps，是現在的兩倍，預計今年年中時可完成標準制訂，但並未提及相關產品的相容性如何。

超高速USB 3.0將提高傳輸效率，但現有傳輸線與連接器是否可支援仍不得而知。

可以確定的是超高速傳輸能讓高清或3D的影音檔案傳輸更為便利，也能讓Nikon D600等搭載24.3MP感光器的高階相機更有用武之地。

預計二月初時Intel將舉辦10Gbps標準研討會，提倡小組成員包括HP、Microsoft、瑞薩、ST-Ercisson和德儀。

2012年，USB 3.0產品較前一年翻倍成長，若超高速USB 3.0維持這樣的聲勢，恐會威脅其他高速傳輸接口技術。 

出自ComputerWorld